PCB ASSEMBLY EQUIPMENT
ASYMTEK Glue Dispensers, Underfill dispensers
TDK Radial Inserters
EKRA Solder Paste Stencil Printers
REHM Reflow Ovens
KIRSTEN Wave Soldering Systems
ASYS Automation PCB Handling / Laser & Ink Marking / Depanelling Systems
DIE-BONDING
TRESKY MicroAssembly - Die Bonding and Component Placement
PCB and DIE INSPECTION EQUIPMENT
VI-TECHNOLOGIES Auto Optical Inspection Systems (AOI)
METRIS XTEK XRay (BGA) Inspection Systems
TECHNOLAB Inspection Microscopes, Videoscopes, Endoscopes
SONOSCAN Acoustic Micro Imaging - SAM Scanning Acoustic Microscopes
PCB SOLDER REWORK EQUIPMENT
ZEVAC PCB Solder Rework (Retouch) Systems
PCB CLEANING AND STENCIL CLEANING
KOLB PCB Cleaning and Stencil Cleaning Equipment, Detergents
PCB CONFORMAL COATING EQUIPMENT
SOLDER (SOLDER-WIRE, SOLDER PASTE) and FLUX
ALMIT Solder Materials (Solder wires, Solder Paste, Flux)
LAVORTEC Sticky (Gel) Flux for Solder Rework
CONFORMAL COATING MATERIALS, SMT GLUES, CASTING RESINS
PETERS -- Conformal Coating Materials, SMT Glues, Casting Resins
PCB Assembly Equipment
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ASYMTEK (USA, Holland) |
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NORDSON ASYMTEK --- FLUID DISPENSING AND JETTING SYSTEMS
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Glue Dispensers Solder Paste Dispensers Conductive Adhesive Dispensers Semiconductor Dispensers For a full range of applications, including flip chip and CSP underfill, dam and fill, die attach, and thermal compounds Dispensers for High-speed, medium-speed and low-speed applications. Very high speed Glue (Adhesive) Dispensing using jetting technology Dispensing with Jetting Technology compared to needle dispensing Inline full automatic dispensing equipment for high speed
Offline equipment for low speed applications:
DISPENSING SOLUTIONS for: PCB Assembly : SMT glue, solder paste, CSP/BGA underfill, Selective flux jetting, conductive adhesives, solder mask dispensing, corner and edge bonding, PoP (Package On Package), embedded assemblies, no-flow underfill. Alternative Energy: Fuel cell and Photovoltaics. LED Assembly: Phosphor, diffuser, silicone, epoxy material dispensing. LED package assembly dispensing. Flat Panel Display Assembly : Sealant jetting, One drop fill, touch panel bonding. Electromechanical : MEMS assembly, RFID assembly, encapsulation and cavity fill, precise bonding, sealing, gasketing, precise lubrication, precise painting. Life Science : Medical device assembly, medical electronics. Semiconductor Packaging : Underfill for flip chip, selective flux jetting, BGA solder ball reinforcement, dam and fill dispensing, chip encapsulation, and cavity fill, die attach dispensing, lid seal, non-conductive paste and no flow underfill, thermal compounds, 3D packaging (stacked pakages, PoP, etc)
NORDSON ASYMTEK --- SELECTIVE CONFORMAL COATING NORDSON ASYMTEK - A World Leader in Selective Conformal Coating Equipment Asymtek Century C-341 -- A Cost-effective automated bench top system for selectively applying conformal coating materials ... Patented technology replaces traditional dip, brush, handgun, and aerosol spray systems.
Asymtek SelectCoat SL-940E is a high-speed, high-accuracy coating system with integrated, closed-loop process control that ensures superior coating quality. Process parameters are recorded and traceable through Easy Coat® (ECXP) software running on Windows® XP operating system. Fluid and air pressure are set and monitored through software-controlled electronic regulators.
SC-205/SC-105 Film Coater Applicator provides non-atomized, selective application of conformal coating materials with viscosities of less than 100 centipoise. With transfer efficiency in excess of 99 percent, the Film Coater applicator improves conformal coating material utilization by 30 to 50 percent. Because the conformal coating material is not atomized, common problems like over-spray, masking, and rework associated with conventional conformal coating processes are minimized. Coating thicknesses range from 0.5 to 8 mils for solvent-based materials and 4 to 8 mils for 100-percent solids materials. There are other applicators for other methods of application.
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TDK (Japan, Germany) |
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RADIAL Lead (through-hole) Component INSERTERS
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TDK Flip-chip Bonding Machine / Dispenser --
Ultrasonic Gold-to-Gold : AFM-15 TDK FOUP LOAD PORT (for semiconductor manufacturing) : TAS300 |
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EKRA (Germany) |
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EKRA STENCIL ( SOLDER PASTE ) PRINTERS --- (Part of ASYS Group)
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REFLOW SOLDERING OVENS
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REHM THERMAL SYSTEMS (Germany) |
CONVECTION REFLOW SOLDERING OVENS
VisionX -- High volume reflow soldering ovens of all SMT components. Optimal and homogeneous heat transfer. Air or Nitrogen.
Easy and low-cost maintenance.
Different models from 6 - 9 preheating zones, 2 - 3 peaking zones, 1 - 4 cooling zones. Length : 4.30m -- 7.10m
Vision 7.1 Mid-range volume.
Compact 2.1 - Ideal for Small and Mid-Sized Manufacturing Lots (5 heating zones)
CondensoBatch -- Ideal for PCBs with large thermal mass. Right-left temperature profile ±2 K
RISE
An Automatic Selective Soldering System, which features:
- 5-axis robot system
- ±180° rotary motion at the Z-axis
- Adjustable soldering angle
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WAVE SOLDERING SYSTEMS
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KIRSTEN Soldering (Switzerland) |
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Kirsten Modula Wave Soldering System (patented)
This innovative wave solder solution offers the user:
Kirsten Magnetic Wave Soldering Pump (Patented)
The patented electromagnetic wave soldering pump from KIRSTEN works without any moving mechanical parts and with only 32 kgs of solder.... Savings on leadfree solder...
SERIES
K5360
Wave Soldering Machines with small solder pot (30kgs - 32kgs)
High-Output Wave Soldering Machines with double-convection preheat zone, 3 modules of radiation tubes (IR or SW or MW), and a standalone fluxer
Lead-Solder and LeadFree Solder
The liquid solder is accelerated by an electromagnetic field. the enamelled pot can be considered as stator and the liquid solder as rotor. Consequences in operating: maximum quietness in running and minimum maintenance efforts. The clever pump principle is excellently suited for the use of lead-free solders and can be combined with either the protection cover oil or now also with the integrated nitrogen inertion system K-IN2ERTWAVE TM.

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PCB HANDLING / LASER MARKING / DEPANELLING SYSTEMS
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ASYS AUTOMATION (Germany) |
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Top
Of Page
DIE BONDING AND MICROASSEMBLY SYSTEMS
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DR.TRESKY (Switzerland) |
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Equipment for Die Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic, Microsystemtechnic, and many more...
Semi Automatic Die Bonder & Component Placer with Wafer Table and Die Ejector
Hybrid Rework System to removes all glued dies from substrate.
Die Bonding and MicroPlacement Die Attach System Model T-3202 Model M-System1 (e.g. Epoxy Die Bonding)
TEST / INSPECTION SYSTEMS
AUTO OPTICAL INSPECTION SYSTEMS
X-Ray Inspection Equipment
OPTICAL Inspection WITH VIDEOSCOPES DIGITAL MICROSCOPES
Inspection Microscopes (Digital Camera Videoscopes) with X, Y,Z arms; Flexible endoscopes to inspect the solder balls under BGAs.... Xenon Cold Light Lamps, Thermo Inspection with Autofocus Infrared Camera, Image Processing and Archiving Software... For more details, please check TechnoLab WEB Site:http://www.technolab.de/_en/products/index.php |
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S.A.M. SCANNING ACOUSTIC MICROSCOPES
World Leader in Non-Destructive internal inspection using Scanning Acoustic Microscopes (S.A.M.) Acoustic Micro Imaging ... Voids, delaminations in die attach... D9000™ C-SAM© The Gold Standard in Acoustic Microscopes
Sonoscan D9000™ C-SAM©
PCB SOLDER REWORK
PCB CLEANING AND STENCIL CLEANING EQUIPMENT
Cleaning Equipment for PCBs and Hybrids Cleaning Equipment for Stencils, Metal Parts, PCB Carriers Detergents for PCB Cleaning For details: Download KOLB Brochure
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ALMIT Solder (Japan, Germany)
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Solder Wires Solder Paste Solder Flux
(Leadfree or lead) (Leadfree or lead)

Solder Wires also for Solder Robots...
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LAVORTEC |
LAVORTEC (Switzerland)
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Sticky Gel Flux for Solder Rework -- Low-cost and successful solder rework ---- Try and see ....
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LACKWERKE PETERS GmbH (Germany)
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Conformal Coatings and solvent-free thick film lacquers for the protection of assembled PCBs against corrosion, partly also water-borne and fluorescent, based on polyurethane, acrylate, epoxy and silicone resins.

Peters Casting Resins
Peters SMT Mounting Glues
Affixes components during wave soldering in the assembly fabrication process
Solvent-free, thus cures without difficulty even in thicker layers so that components with a high clearance to the printed circuit board can also be affixed
Viscous, pasty so that there is virtually no bleeding at gluing points
No premature drying because exclusively thermally curing 1-pack system
Fast thermal cure means short processing times
For more details, please check WEB Site: http://www.peters.de/index_e.htm