PCB ASSEMBLY
-- PCB INSPECTION -- PCB SOLDER REWORK
PCB ASSEMBLY EQUIPMENT
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TDK
SMT Chip Shooters and
Fine Pitch Assembly Machines
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TDK
Radial Inserters
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EKRA Solder Paste Stencil Printers
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REHM Reflow Ovens
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ASYMTEK Glue Dispensers, Underfill
dispensers
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KIRSTEN
Wave Soldering Systems
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ASYS Automation
PCB Handling / Laser & Ink Marking / Depanelling Systems
PCB INSPECTION
EQUIPMENT
PCB SOLDER
REWORK EQUIPMENT
PCB CONFORMAL
COATING EQUIPMENT
SOLDER
(SOLDER-WIRE, SOLDER PASTE) and FLUX
CONFORMAL
COATING MATERIALS, SMT GLUES, CASTING RESINS
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TDK
(Japan, Germany) |
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SMT Pick and Place Machines
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MA-2N: Multi-Function Pick & Place Machine
A combination of chip shooter and odd-form
component placer, is an ideal choice for today’s production such as frequent
product changes and high mix jobs. It covers a wide range of components,
offers high accuracy and high productivities as well as high work efficiency
of 4 independent heads.
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RADIAL Lead (through-hole) Component INSERTERS
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TDK Flip-chip Bonding Machine / Dispenser --
Ultrasonic Gold-to-Gold : AFM-15
TDK FOUP LOAD PORT
(for semiconductor manufacturing) : TAS300 |
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EKRA
(Germany) |
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EKRA STENCIL ( SOLDER PASTE ) PRINTERS --- (Part of ASYS Group)
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Inline,
automatic or offline semiautomatic Stencil
Printers all made in Germany
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Very
Accurate printing with a Repeatability of +/-
15µm
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Very
easy to use software
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Patented
EKRA Vision Alignment System (EVA) with
patented 2˝
D Inspection System,
allowing also qualified paste thickness
inspections
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FREE
OF CHARGE “Remote maintenance,
service & support interface with
software” allowing Ekra engineers to
see customer machine over the internet and
check the programs, settings, etc. to give
our customers highly valuable support and
reducing down time.
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 X1 |
| Semi-automatic
screen-printing machine |
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X1 Series has been developed for areas of
application which require optimum
precision and economy. As well as these,
easy operation, short format conversion
times and a great versatility were factors
incorporated into the conception of this
machine. It is possible to print... |
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| X3 |
| Automatic
screen-printing and stencil-printing
machine |
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| Screen
printing machine X3 for printing PCBs and
flat assemblies with solder paste, glue or
arbitrary functional layers. Stencil
frames from 350 x 350 mm to 736 x736 mm
can be used directly, without adapters and
are clamped using pneumatics to the upper
assembly. A combination of a squeegee and
a flood bar... |
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| X5
Serie |
| Automatic
screen-printing and stencil-printing
machine |
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| The X5
series provides printing surfaces in the
range between 460 x 460 mm and 915 x 610
mm as well as adjustable stencil sizes -
without any need for an adapter - between
300 x 300 mm and 1270 x 1700 mm. The
printable curcuit-board sizes are
equivalent to the processing capacities of
most ... |
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| X6 |
| Automatic
screen-printing and
stencil-printing machine |
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X6 is the logical
development within the X
series and can handle
frames, without an adapter
of 300 mm x 300 mm up to 850
mm x 850 mm. The ability to
handle PCBs of this size
corresponds to the
processing capability of
most Pick and Place-Systems
allowing you to have a
flexible production with
very few limitations! |
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| XE1-M |
| Semi-automatic
screen-printing and
stencil-printing machine |
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| Semi-automatic
screen printer XE1-M for
printing LTCCs, ceramic
substrates, fuel cells,
solar cells, PCBs or similar
materials. The machine is
highly accurate and can
reach very short cycle times
since the entire table is
constructed on air bearings
on a granite plate. The
machine can be quickly
and... |
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| XE2 |
| Automatic
screen-printing and
stencil-printing machine |
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XE2 Screen printermachine is
constructed as follows:
Stable frame with a mounted
transport conveyor. All
functions and parts
concerned with the machine
accuracy are mounted onto a
granite plate which is
independent of the machine
frame. The substrate or the
PCB is transported... |
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| X4
Base |
| Automatic
screen-printing and stencil-printing
machine |
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| The highest
levels of accuracy come as standard with
this printer.The machine works with an
accuracy of +- 15 µm @ 4 sigma, levels
which are unrivalled by any other product
in its price category. The standard
features of this machine are shared by the
entire range of EKRA stencil printers
which guarantees ... |
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| X4
Professional |
| Automatic
screen-printing and stencil-printing
machine |
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| The standard
version of the X4 Professional comes with
stencil-cleaning and stencil inspection
functions as well as a 2˝-D postprint
inspection capacity. The integration of
closed squeegee systems (Proflow) has also
been enabled. The use of an open-can
control system has allowed us to set new
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| X5-STS |
| Semi-automatic
screen-printing and stencil-printing
machine |
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| Complies
with the highest requirements of
laboratory applications and series
production. We have further improved the
successful concept of our X platform,
combining the benefits of an in-line
printer with the flexibility of a
semi-automatic system in a single
screen-printing and... |
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| XM |
| Semi-automatic
Screen and Stencil printer |
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manual, semi-automatic screen and stencil
printer. The sideways guided squeegee
traverse and the adjustable squeegee
pressure, ensure a constant, high quality
print. Simple operation, short conversion
times all belong to the application
oriented concept. It is possible... |
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REHM
THERMAL SYSTEMS
(Germany)
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CONVECTION REFLOW SOLDERING OVENS
VisionX --
High volume reflow soldering ovens of all
SMT components. Optimal and homogeneous heat transfer. Air or Nitrogen.
Easy and low-cost maintenance.
Different models from 6 - 9 preheating zones,
2 - 3 peaking zones, 1 - 4 cooling zones. Length : 4.30m -- 7.10m
Vision
7.1 Mid-range volume.
Compact
2.1 - Ideal for Small and
Mid-Sized Manufacturing Lots (5 heating zones)
CONDENSATION REFLOW SOLDERING
CondensoBatch -- Ideal for PCBs
with large thermal mass. Right-left
temperature profile ±2 K
SELECTIVE REWORK
RISE
An Automatic
Selective Soldering System, which features:
- 5-axis robot system
- ±180° rotary motion at the Z-axis
- Adjustable soldering angle
LIQUID DISPENSING
(GLUE, SOLDER PASTE, UNDERFILL )
selectIve
conformal
coatýng
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ASYMTEK
DISPENSING SYSTEMS
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Glue Dispensers
Solder Paste Dispensers
Conductive Adhesive Dispensers
Semiconductor Dispensers -- For a full
range of applications, including flip chip and CSP
underfill, dam and fill, die attach, and thermal compounds
Dispensers for High-speed, medium-speed
and low-speed applications.
Very high speed Glue (Adhesive) Dispensing
using jetting technology
Dispensing with
Jetting
Technology compared to needle dispensing
Inline full automatic dispensing
equipment for high speed and offline equipment for low speed
applications
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X-1010
Axiom™
SMT Dispenser
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X-1020
Axiom™
Semiconductor Dispenser
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X-1020 Axiom™
Cleanroom Dispenser
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X-1022
Axiom™
Semiconductor Dual-Lane Dispenser - NEW
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X-1030
Axiom™
Flux Dispenser
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X-1032
Axiom™
Flux Dual-Lane Dispenser
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G-5000 Flat
Panel Display Dispenser - NEW
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M-2020
Millennium®
Ultra High Speed Semiconductor Dispenser
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M-2010
Millennium®
Ultra High Speed SMT Dispenser
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S-820
Spectrum™
Precision Batch Semiconductor Dispenser
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D-580
DispenseMate®
Benchtop Dispensing System - NEW
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D-550
DispenseMate®
Benchtop Dispensing System
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C-730
Century®
Selective Flux Dispenser
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C-718
Century®
Precision SMT Dispenser
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Ultra TT - XYZ Dispensing Robot System
ASYMTEK SELECTIVE
CONFORMAL COATING
C-740 and C-741
Century®
Selective Conformal Coating System
C-341
Century®
Selective Conformal Coating System - NEW
SC-400
PreciseCoat™
Jet - NEW
SC-300
Swirl Coat™
Applicator
Four-Position
Tilt Accessory
SC-205/SC-105 Film Coater Applicator
Viscosity Control System
Control
Coat Dispensing Applicator
Swirl Coat
Dispensing Applicator
Inline
Inverter Module
Laser
Fan Width Control
Flow
Monitor Module for Conformal Coating
ECXP Easy
Coat®
for Windows®
XP Software
Curing Modules
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Wave Soldering Systems
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Wave Soldering Machines with small solder pot
(30kgs - 32kgs)
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High-Output Wave Soldering Machines with
double-convection preheat zone, 3 modules of radiation tubes (IR or SW or
MW), and a standalone fluxer
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Lead-Solder and LeadFree Solder
KIRSTEN MAGNETIC WAVE SOLDERING PUMP
(Patented)
The
patented electromagnetic wave soldering pump from KIRSTEN
works without any
moving mechanical parts and with
only 32 kgs of solder.... Savings
on leadfree solder...
The
liquid solder is accelerated by an electromagnetic field. the enamelled pot can
be considered as stator and the liquid solder as rotor. Consequences in
operating: maximum quietness in running and minimum maintenance efforts. The
clever pump principle is excellently suited for the use of lead-free solders and
can be combined with either the protection cover oil or now also with the
integrated nitrogen inertion system K-IN2ERTWAVE TM.
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PCB
HANDLING / LASER MARKING / DEPANELLING SYSTEMS
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ASYS
AUTOMATION (Germany) |
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ASYS AUTOMATION
PRODUCTS:
PCB
Handling -- Laser Marking -- Ink Marking -- Label
Applicators -- PCB Depanelling -- Final Assembly Lines
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PCB
Loading systems
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PCB Unloading systems
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PCB
Conveyor systems
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PCB
Flip and Turn systems
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PCB
Buffer systems
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PCB
Marking systems (Laser Marking, Ink Marking, Label Application)
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PCB
Depaneling systems
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Special
systems
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AUTO
OPTICAL INSPECTION SYSTEMS
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VI
TECHNOLOGY (France and USA) |
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Automatic
OPTICAL INSPECTION Systems
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Robust,
simple and efficient AOI systems empowered with VECTORAL
IMAGING so that you can achieve the best possible yield of your
investment:
Vectoral imaging sets a new industry standard in AOI
technology due to:
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The ability to drastically reduce programming time.
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Unprecedented accuracy in error detection.
- Extremely low false
failure rates.
VI-3K
Series
These
equipment are a new upgradeable inspection solution to meet
both current and future requirements : an industry first. To enhance
the accuracy, the equipment has State-of-the-art
X-Y gantry with composite
GRANITE base.
Inspection
capabilities include presence, absence, polarity and placement
accuracy as well as OCV and solder joints thanks to ProfilerTM
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Proprietary tri-color axial & radial lighting system.
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High resolution digital camera with 1376 x 1040 pixels - 32µm
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Automatic Optical inspection of both
SMT as
well as through-hole components
VI-5000
Series
These
are are the most accurate AOI machines worldwide.
-Automatic
Optical inspection of both SMT
as well as through-hole
components
Inspection
capabilities include presence, absence, polarity and placement
accuracy as well as OCV and solder joints thanks to Profiler™
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Accuracy
For
more accuracy, the system was developed using:
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X-Y gantry with dual X motorization, granite
base with
cast iron frame.
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High speed dual axis linear motors and granite beam for Y-Axis.
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Closed loop linear motors with high resolution linear encoders.
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High resolution digital camera with 1280 x 1024 resolution 32 µ.
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X-Ray Inspection Equipment
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METRIS X-TEK
(U.K.,
Belgium)) |
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X
- RAY Inspection of BGA components |
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Real-time,
true microfocus X-RAY INSPECTION equipment with patented "open
tube" technology.
Linx
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Low cost 100kV X-RAY inspection system. BGA void Analysis software run
on PC and TFT Monitor. Image Intensifier manually adjustable for oblique
angle views up to 45°.
Ultrafocus (5mm)
target.
 
Compact
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Versatile, small PCB inspection system
Revolution
: A revolution in PCB Inspection - Submicron resolution,
strong xray penetration with 160 kV, amazing 75 degree oblique angle viewing,
BGA fault Analysis Software, dual monitor ...
CT (Computer
Tomography) analysis hardware & software is optional. Get a solid
representation of slices and view them by rotating it.
XTEK also supplies high resolution
vacuum de-mountable x-ray sources for the following applications
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BGA components
Electronic assemblies
PCB assembly
BGA solder joint inspection
IC Package Inspection
Automotive assemblies
Aerospace |
Pharmaceutical Devices
NDT
Scientific and Research
Medical Research
Ordnance |
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For more details,
please check WEB Site:http://www.xtekxray.com
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OPTICAL Inspection WITH VIDEOSCOPES
DIGITAL MICROSCOPES
TECHNOLAB
(Germany) |
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Inspect PCBs, BGAs, anything with digital microscopes
(videoscopes), flexible endoscopes, thermoscopes.... |
Inspection
Microscopes (Digital Camera Videoscopes) with X, Y,Z arms; Flexible
endoscopes to inspect the solder balls under BGAs....
Xenon Cold Light
Lamps, Thermo Inspection with Autofocus Infrared Camera, Image
Processing and Archiving Software...
For more details,
please check TechnoLab WEB Site:http://www.technolab.de/_en/products/index.php
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ZEVAC
(Switzerland and USA) |
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| Solder Rework (Selective
Soldering & Desoldering) Equipment for:
BGA, uBGA, CSP, QFP, PLCC and all other SMT
Components.
All models are “Leadfree capable” |
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| SMT Solder Rework |
| ONYX21 (Leadfree capable) |
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Standard machine
with an outstanding price/performance relation. Manual positioning and
accurate placement.
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DRS24
(Leadfree capable) |
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A special vision
system (with motorized z-axis) for very accurate aligment of all SMD's
and fine-pitch components. Ideal for BGAs, uBGAs, QFPs, PLCCs and all other ultrafine pitch
QFPs.
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| SMT Solder Rework and Automated prototype production
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ONYX 24 (Leadfree
capable) |
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Semi-automatic
process control for all kind of SMD rework applications. The bottom
heater with a large surface of 300x300mm offers 3500 W heating power.
On all ONYX machines nitrogen input is standard.
Automatic placement of components using Force Measuring System.
All existing SMD components
like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings.
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ONYX 25 (Leadfree
capable) |
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Semi-automated Selective Soldering and Desoldering System. All existing SMD components
like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings,
special and large SMT components upto 75mm.
ONYX 25 is
especially designed for extremely large boards-up to 520mm large and
unlimited in the depth. Component height clearence is 30mm or 70mm high.
Automatic placement of components using Force Measuring System. REDDOT
design award 2006
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ONYX 29 (Leadfree
capable) |
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Semi-automated
selective Soldering and Desoldering System. All existing SMD components
like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings,
special SMT components.
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| ONYX 32 (Leadfree
capable) |
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Automated
Multifunctional Positioning and Soldering System. Hot Gas Soldering
(Rework) System (Standard). Optional: Conductive Heat Soldering System,
Flip Chip Bonder, Dispenser System.The entire ONYX32 is controlled and
automated via the user-friendly software Visual Machines. |
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Through-Hole Multipin
Connector or leaded IC Solder Rework |
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SSM 4
and SSM4A (Leadfree capable)
Standard Model to
solder and desolder leaded components,
ICs,
multi-pin connectors
SSM 9 (Leadfree
capable)
Operator independent model to solder and
desolder leaded components, ICs, multi-pin connectors |
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For
more details, please check WEB Site:http://www.zevac.ch |
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ALMIT
Solder
(Japan, Germany)
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Solder Wires
Solder Paste
Solder Flux
(Leadfree
or lead)
(Leadfree or lead)
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LAVORTEC |
LAVORTEC
(Switzerland)
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Sticky
Gel Flux for Solder Rework --
Low-cost and successful solder rework ---- Try and see ....
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LACKWERKE
PETERS GmbH
(Germany)
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Conformal
Coatings and solvent-free thick
film lacquers for the protection of
assembled PCBs against corrosion, partly also water-borne and fluorescent, based
on polyurethane, acrylate, epoxy and silicone resins.
Peters Conformal Coatings
- Excellent protection against corrosion (e.g.
against electro corrosion and migration)
- Extremely low risk of dissolving components
and marking inks
- Very good dielectric properties and very high
tracking resistance
- Suitable for coating flexible circuits
("flex-to-install", bend stress during assembly only)
- Can be soldered-through at soldering iron
temperature for repair purposes
- Colourless transparent and/or fluorescent
(index FLZ) adjustments enable the completeness of the coating to be easily
controlled under day or UV light (black light)
- partially special adjustments (e.g. ELPEGUARD®
SL 1301 ECO-FLZ/23) for the processing by means of selective coating units are
available
Peters Casting Resins
- Wepox casting resins on epoxy resin basis (EP)
- Wepuran casting resins on polyurethane resin
basis (PUR)
