PCB AND DIE ASSEMBLY -- INSPECTION -- SOLDER REWORK - CLEANING - CONFORMAL COATING

PCB ASSEMBLY EQUIPMENT

DIE-BONDING

PCB and DIE INSPECTION EQUIPMENT

PCB SOLDER REWORK EQUIPMENT

PCB CLEANING AND STENCIL CLEANING

PCB CONFORMAL COATING EQUIPMENT

SOLDER (SOLDER-WIRE, SOLDER PASTE) and FLUX    

  CONFORMAL COATING MATERIALS, SMT GLUES, CASTING RESINS

PCB Assembly Equipment

 

 

   

  ASYMTEK (USA, Holland) 

NORDSON ASYMTEK --- FLUID DISPENSING AND JETTING SYSTEMS

 

Glue Dispensers

Solder Paste Dispensers

Conductive Adhesive Dispensers

Semiconductor Dispensers

For a full range of applications, including flip chip and CSP underfill, dam and fill, die attach, and thermal compounds

Underfill for Flip Chips

Dispensers for High-speed, medium-speed and low-speed applications.

Very high speed Glue (Adhesive) Dispensing using jetting technology 

Dispensing with Jetting Technology  compared to needle dispensing

Inline full automatic dispensing equipment for high speed

Offline equipment for low speed applications:

 

 

 

 

DISPENSING SOLUTIONS for:

PCB Assembly : SMT glue, solder paste, CSP/BGA underfill, Selective flux jetting, conductive adhesives, solder mask dispensing, corner and edge bonding, PoP (Package On Package), embedded assemblies, no-flow underfill.

Alternative Energy: Fuel cell and Photovoltaics.

LED Assembly: Phosphor, diffuser, silicone, epoxy material dispensing. LED package assembly dispensing.

Flat Panel Display Assembly : Sealant jetting, One drop fill, touch panel bonding.

Electromechanical : MEMS assembly, RFID assembly, encapsulation and cavity fill, precise bonding, sealing, gasketing, precise lubrication, precise painting.

Life Science : Medical device assembly, medical electronics.

Semiconductor Packaging : Underfill for flip chip, selective flux jetting, BGA solder ball reinforcement, dam and fill dispensing, chip encapsulation, and cavity fill, die attach dispensing, lid seal, non-conductive paste and no flow underfill, thermal compounds, 3D packaging (stacked pakages, PoP, etc)

 


 

NORDSON ASYMTEK --- SELECTIVE CONFORMAL COATING

NORDSON ASYMTEK - A World Leader in Selective Conformal Coating Equipment

Asymtek Century C-341 -- A Cost-effective automated bench top system for selectively applying conformal coating materials ... Patented technology replaces traditional dip, brush, handgun, and aerosol spray systems.

 

 

 

Asymtek Century C-341

 

 

Asymtek SelectCoat SL-940E is a high-speed, high-accuracy coating system with integrated, closed-loop process control that ensures superior coating quality. Process parameters are recorded and traceable through Easy Coat® (ECXP) software running on Windows® XP operating system. Fluid and air pressure are set and monitored through software-controlled electronic regulators.

 

 

 

 

SC-205/SC-105 Film Coater Applicator provides non-atomized, selective application of conformal coating materials with viscosities of less than 100 centipoise. With transfer efficiency in excess of 99 percent, the Film Coater applicator improves conformal coating material utilization by 30 to 50 percent.  Because the conformal coating material is not atomized, common problems like over-spray, masking, and rework associated with conventional conformal coating processes are minimized.  Coating thicknesses range from 0.5 to 8 mils for solvent-based materials and 4 to 8 mils for 100-percent solids materials. There are other applicators for other methods of application.

 

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  TDK (Japan, Germany)

 

RADIAL Lead (through-hole) Component INSERTERS 

TDK Flip-chip Bonding Machine / Dispenser -- Ultrasonic Gold-to-Gold : AFM-15

TDK FOUP LOAD PORT (for semiconductor manufacturing) : TAS300

 

 

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   EKRA (Germany)

 

 

EKRA  STENCIL ( SOLDER PASTE ) PRINTERS --- (Part of ASYS Group)

 
  • Inline, automatic or offline semiautomatic Stencil Printers all made in Germany 

  • Very Accurate printing with a Repeatability of +/- 15µm

  • Very easy to use software

  • Patented EKRA Vision Alignment System (EVA) with patented 2˝ D Inspection System, allowing also qualified paste thickness inspections

  • FREE OF CHARGE “Remote maintenance, service & support interface with software” allowing Ekra engineers to see customer machine over the internet and check the programs, settings, etc. to give our customers highly valuable support and reducing down time.

 

 
  X1
Semi-automatic screen-printing machine
The X1 Series has been developed for areas of application which require optimum precision and economy. As well as these, easy operation, short format conversion times and a great versatility were factors incorporated into the conception of this machine. It is possible to print...
 
 
 
 
 
  X3
Automatic screen-printing and stencil-printing machine
Screen printing machine X3 for printing PCBs and flat assemblies with solder paste, glue or arbitrary functional layers. Stencil frames from 350 x 350 mm to 736 x736 mm can be used directly, without adapters and are clamped using pneumatics to the upper assembly. A combination of a squeegee and a flood bar...
 
 
 
 
  X5 Serie
Automatic screen-printing and stencil-printing machine
The X5 series provides printing surfaces in the range between 460 x 460 mm and 915 x 610 mm as well as adjustable stencil sizes - without any need for an adapter - between 300 x 300 mm and 1270 x 1700 mm. The printable curcuit-board sizes are equivalent to the processing capacities of most ...
 
   
 
 
  X6
Automatic screen-printing and stencil-printing machine
The X6 is the logical development within the X series and can handle frames, without an adapter of 300 mm x 300 mm up to 850 mm x 850 mm. The ability to handle PCBs of this size corresponds to the processing capability of most Pick and Place-Systems allowing you to have a flexible production with very few limitations!
 
 
 
 
 
  XE1-M
Semi-automatic screen-printing and stencil-printing machine
Semi-automatic screen printer XE1-M for printing LTCCs, ceramic substrates, fuel cells, solar cells, PCBs or similar materials. The machine is highly accurate and can reach very short cycle times since the entire table is constructed on air bearings on a granite plate. The machine can be quickly and...
 
 
 
 
 
  XE2
Automatic screen-printing and stencil-printing machine
The XE2 Screen printermachine is constructed as follows: Stable frame with a mounted transport conveyor. All functions and parts concerned with the machine accuracy are mounted onto a granite plate which is independent of the machine frame. The substrate or the PCB is transported...
 
  X4 Base
Automatic screen-printing and stencil-printing machine
The highest levels of accuracy come as standard with this printer.The machine works with an accuracy of +- 15 µm @ 4 sigma, levels which are unrivalled by any other product in its price category. The standard features of this machine are shared by the entire range of EKRA stencil printers which guarantees ...
 
 
 
 
 
  X4 Professional
Automatic screen-printing and stencil-printing machine
The standard version of the X4 Professional comes with stencil-cleaning and stencil inspection functions as well as a 2˝-D postprint inspection capacity. The integration of closed squeegee systems (Proflow) has also been enabled. The use of an open-can control system has allowed us to set new ...
 
 
 
 
 
  X5-STS
Semi-automatic screen-printing and stencil-printing machine
Complies with the highest requirements of laboratory applications and series production. We have further improved the successful concept of our X platform, combining the benefits of an in-line printer with the flexibility of a semi-automatic system in a single screen-printing and...
 
 
 
 
 
  XM
Semi-automatic Screen and Stencil printer
The XM is a manual, semi-automatic screen and stencil printer. The sideways guided squeegee traverse and the adjustable squeegee pressure, ensure a constant, high quality print. Simple operation, short conversion times all belong to the application oriented concept. It is possible...
 

 

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REFLOW SOLDERING OVENS

 

   

  REHM THERMAL SYSTEMS  (Germany) 

CONVECTION REFLOW SOLDERING OVENS

    VisionX -- High volume reflow soldering ovens of all SMT components. Optimal and homogeneous heat transfer.  Air or Nitrogen.

                                Easy and low-cost maintenance.

                                Different models from 6 - 9 preheating zones, 2 - 3 peaking zones, 1 - 4 cooling zones. Length : 4.30m -- 7.10m

      Vision 7.1 Mid-range volume.

    Compact 2.1 - Ideal for Small and Mid-Sized Manufacturing Lots (5 heating zones)

 

CONDENSATION REFLOW SOLDERING

    CondensoBatch -- Ideal for PCBs with large thermal mass. Right-left temperature profile ±2 K

SELECTIVE REWORK

    RISE

       An Automatic Selective Soldering System, which features:

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WAVE SOLDERING SYSTEMS

 

 

 

   

  KIRSTEN Soldering (Switzerland) 

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Kirsten Modula Wave Soldering System (patented)

This innovative wave solder solution offers the user:

 

 

 

 

Kirsten Magnetic Wave Soldering Pump (Patented)

The patented electromagnetic wave soldering pump from KIRSTEN works without any moving mechanical parts and with only 32 kgs of solder.... Savings on leadfree solder...

SERIES K5360

The liquid solder is accelerated by an electromagnetic field. the enamelled pot can be considered as stator and the liquid solder as rotor. Consequences in operating: maximum quietness in running and minimum maintenance efforts. The clever pump principle is excellently suited for the use of lead-free solders and can be combined with either the protection cover oil or now also with the integrated nitrogen inertion system K-IN2ERTWAVE TM.

 

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PCB HANDLING / LASER MARKING / DEPANELLING  SYSTEMS

 

 

 

 

  

  

           ASYS AUTOMATION (Germany)

 

 

ASYS AUTOMATION PRODUCTS:

 

PCB Handling -- Laser Marking --  Ink Marking -- Label Applicators -- PCB Depanelling --  Final Assembly Lines

 

 

PCB Loading systems

     

PCB Unloading systems

 

PCB Conveyor systems

 

PCB Flip and Turn systems

 

PCB Buffer systems

 

PCB Marking systems (Laser Marking,  Ink Marking, Label Application)

 

PCB Depaneling systems

 

Special systems

   

 

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DIE BONDING  AND  MICROASSEMBLY SYSTEMS

 

 

 

 

  

  

           DR.TRESKY (Switzerland)

 

 

Equipment for Die Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic, Microsystemtechnic, and many more...

 

Semi Automatic Die Bonder & Component Placer with Wafer Table and Die Ejector

 

Hybrid Rework System to removes all glued dies from substrate.

    

 

Die Bonding and MicroPlacement                           Die Attach System                                   

Model T-3202                                                                  Model M-System1 (e.g. Epoxy Die Bonding)

 

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TEST / INSPECTION SYSTEMS

 

 

AUTO OPTICAL INSPECTION SYSTEMS

 

 

 

  

  

              VI TECHNOLOGY    (France and USA)

 

  

Automatic OPTICAL INSPECTION Systems

 

 

Robust, simple and efficient AOI systems empowered with  VECTORAL IMAGING so that you can achieve the best possible yield of your investment:

 

  Vectoral imaging sets a new industry standard in AOI technology due to:

 

-  The ability to drastically reduce programming time.

 

Unprecedented accuracy in error detection.

 

- Extremely low false failure rates.

 

 

VI-3K Series 

These equipment are a new upgradeable inspection solution to meet both current and future requirements : an industry first. To enhance the accuracy, the equipment has State-of-the-art X-Y gantry with composite GRANITE base.

 

Inspection capabilities include presence, absence, polarity and placement accuracy as well as OCV and solder joints thanks to ProfilerTM .

 

- Proprietary tri-color axial & radial lighting system.

 

- High resolution digital camera with 1376 x 1040 pixels - 32µm

 

- Automatic Optical inspection of both SMT as well as through-hole components

 

 

 

 

 

 

VI-5000 Series

These are are the most accurate AOI machines worldwide.

 

-Automatic Optical inspection of both SMT as well as through-hole components

 

Inspection capabilities include presence, absence, polarity and placement accuracy as well as OCV and solder joints thanks to Profiler™ .

 

Accuracy

For more accuracy, the system was developed using:

 

- X-Y gantry with dual X motorization, granite base with cast iron frame.

 

- High speed dual axis linear motors and granite beam for Y-Axis.

 

- Closed loop linear motors with high resolution linear encoders.

 

- High resolution digital camera with 1280 x 1024 resolution 32 µ.

 

 

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X-Ray Inspection Equipment

 

       

  METRIS  X-TEK  (U.K., Belgium)) 

 

 X - RAY Inspection of BGA components 

Real-time, true microfocus  X-RAY INSPECTION equipment with patented "open tube" technology.

 

 

 

Linx : Low cost 100kV X-RAY inspection system. BGA void Analysis software run on PC and TFT Monitor. Image Intensifier manually adjustable for oblique angle views up to 45°. Ultrafocus (5mm) target.

 

 


 

Compact : Versatile, small PCB inspection system


 

Revolution : A revolution in PCB Inspection - Submicron resolution, strong xray penetration with 160 kV, amazing 75 degree oblique angle viewing, BGA fault  Analysis  Software, dual monitor ... 

CT (Computer Tomography) analysis hardware & software is optional. Get a solid representation of slices and view them by rotating it.


 

XTEK also supplies high resolution vacuum de-mountable x-ray sources for the following applications

BGA components

Electronic assemblies

PCB assembly

BGA solder joint inspection

IC Package Inspection

Automotive assemblies

Aerospace

Pharmaceutical Devices

NDT

Scientific and Research

Medical Research

Ordnance

 

For more details, please check WEB Site:http://www.xtekxray.com

 

 

 

 

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OPTICAL Inspection WITH VIDEOSCOPES 

DIGITAL MICROSCOPES 

      TECHNOLAB   (Germany)
 

Inspect PCBs, BGAs, anything with digital microscopes (videoscopes), flexible endoscopes, thermoscopes....

 

 

   

 

Inspection Microscopes (Digital Camera Videoscopes) with X, Y,Z arms; Flexible endoscopes to inspect the solder balls under BGAs.... 

Xenon Cold Light Lamps, Thermo Inspection with Autofocus Infrared Camera, Image Processing and Archiving Software... 

For more details, please check TechnoLab WEB Site:http://www.technolab.de/_en/products/index.php

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S.A.M.  SCANNING ACOUSTIC MICROSCOPES 

 

    SONOSCAN (USA)

World Leader in Non-Destructive internal inspection using Scanning Acoustic Microscopes (S.A.M.)

Acoustic Micro Imaging ...  Voids, delaminations in die attach...

D9000™ C-SAM©     The Gold Standard in Acoustic Microscopes

          

                                                                                                    Sonoscan D9000™ C-SAM© 

 

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PCB SOLDER REWORK

 

 

 

    ZEVAC (Switzerland and USA)

 

  

Solder Rework (Selective Soldering & Desoldering) Equipment for:

BGA, uBGA, CSP, QFP, PLCC and all other SMT Components.

All models are  “Leadfree capable”

 
SMT Solder Rework
ONYX21 (Leadfree capable)

Standard machine with an outstanding price/performance  relation. Manual positioning and accurate placement.

 

DRS24  (Leadfree capable)

A special vision system (with motorized z-axis) for very accurate aligment of all SMD's and fine-pitch components. Ideal for BGAs, uBGAs, QFPs, PLCCs and all other ultrafine pitch QFPs.

 

SMT Solder Rework and Automated prototype production

 

ONYX 24      (Leadfree capable)

Semi-automatic process control for all kind of SMD rework applications. The bottom heater with a large surface of 300x300mm offers 3500 W heating power.  On all ONYX machines nitrogen input is standard. Automatic placement of components using Force Measuring System.  All existing SMD components like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings.  

 

 

ONYX 25      (Leadfree capable)

Semi-automated Selective Soldering and Desoldering System. All existing SMD components like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings, special and large SMT components upto 75mm. ONYX 25 is especially designed for extremely large boards-up to 520mm large and unlimited in the depth. Component height clearence is 30mm or 70mm high. Automatic placement of components using Force Measuring System.  REDDOT design award 2006

 

ONYX 29      (Leadfree capable)

Semi-automated selective Soldering and Desoldering System. All existing SMD components like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings, special SMT components.

 

ONYX 32  (Leadfree capable)

Automated Multifunctional Positioning and Soldering System. Hot Gas Soldering (Rework) System (Standard). Optional: Conductive Heat Soldering System, Flip Chip Bonder, Dispenser System.The entire ONYX32 is controlled and automated via the user-friendly software Visual Machines.

 

 

Through-Hole Multipin Connector or leaded IC Solder Rework

 

SSM 4 and SSM4A (Leadfree capable)

Standard Model to solder and desolder leaded components, ICs, multi-pin connectors

 

SSM 9 (Leadfree capable)

Operator independent model to solder and desolder leaded components, ICs, multi-pin connectors

 

For more details, please check WEB Site:http://www.zevac.ch

 

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PCB CLEANING AND STENCIL CLEANING EQUIPMENT

 

   

 

 

  

  kolb  Cleaning Technology (Germany)

            

 

Cleaning Equipment for PCBs and Hybrids

Cleaning Equipment for Stencils, Metal Parts, PCB Carriers

Detergents for PCB Cleaning

       For details: Download KOLB Brochure

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SOLDER,  flux, COATING RESINS

 

 

 

  

  ALMIT  Solder  (Japan, Germany)

            

 

 

   Solder Wires             Solder Paste             Solder Flux

 (Leadfree or lead)        (Leadfree or lead)    

        

Solder Wires also for Solder Robots...

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 LAVORTEC

  

  LAVORTEC (Switzerland)

            

 

  

Sticky Gel Flux for Solder Rework        --  Low-cost and successful solder rework ----  Try and see  ....

           

 

 

             

  

  LACKWERKE PETERS GmbH (Germany)

            

 

Conformal Coatings and solvent-free thick film lacquers for the protection of assembled PCBs against corrosion, partly also water-borne and fluorescent, based on polyurethane, acrylate, epoxy and silicone resins.

Peters Conformal Coatings

Peters Casting Resins

Peters SMT Mounting Glues

For more details, please check WEB Site: http://www.peters.de/index_e.htm

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