ASYS AUTOMATION PRODUCTS:

PCB Handling -- Laser Marking --  Ink Marking -- Label Applicators -- PCB Depanelling --  Final Assembly Lines

PCB Loading systems

PCB Unloading systems

PCB Conveyor systems

PCB Flip and Turn systems

PCB Buffer systems

PCB Marking systems:

Laser Marking  : Insignum Laser marking Systems

Ink Marking

Label Application

PCB Depaneling systems

Special systems

              VI TECHNOLOGY    (France and USA)

Automatic OPTICAL INSPECTION Systems

Robust, simple and efficient AOI systems empowered with  VECTORAL IMAGING so that you can achieve the best possible yield of your investment:

  Vectoral imaging sets a new industry standard in AOI technology due to:

-  The ability to drastically reduce programming time.

-  Unprecedented accuracy in error detection.

- Extremely low false failure rates.

VI-3K Series 

These equipment are a new upgradeable inspection solution to meet both current and future requirements : an industry first. To enhance the accuracy, the equipment has State-of-the-art X-Y gantry with composite GRANITE base.

Inspection capabilities include presence, absence, polarity and placement accuracy as well as OCV and solder joints thanks to Profiler^TM .

- Proprietary tri-color axial & radial lighting system.

- High resolution digital camera with 1376 x 1040 pixels - 32µm

- Automatic Optical inspection of both SMT as well as through-hole components

VI-5000 Series

These are are the most accurate AOI machines worldwide.

-Automatic Optical inspection of both SMT as well as through-hole components

Inspection capabilities include presence, absence, polarity and placement accuracy as well as OCV and solder joints thanks to Profiler™ .

Accuracy

For more accuracy, the system was developed using:

- X-Y gantry with dual X motorization, granite base with cast iron frame.

- High speed dual axis linear motors and granite beam for Y-Axis.

- Closed loop linear motors with high resolution linear encoders.

- High resolution digital camera with 1280 x 1024 resolution 32 µ.

  NIKON  X-TEK  (U.K., Belgium)) 

 X - RAY Inspection of BGA components 

Real-time, true microfocus  X-RAY INSPECTION equipment with patented "open tube" technology.

NIKON XT V 130 -- New X-ray inspection system for electronics quality assurance.

30-130kV open micro-focus X-ray source, a 4-axis... Affordable but powerful.

• In-house micro-focus source with 3-micron focal spot size

• Change position, angle and zoom as desired

• 4-inch image intensifier, optically coupled to a high-resolution digital CCD camera

• Large set of 16-bit image processing tools

• True 60° tilting angle for easy inspection of internal features

XT V 160 NanoTech Revolution : A revolution in PCB Inspection - Submicron resolution, strong xray penetration with 160 kV, amazing 75 degree oblique angle viewing, BGA fault  Analysis  Software, dual monitor ... 

CT (Computer Tomography) analysis hardware & software is optional. Get a solid representation of slices and view them by rotating it.

XTEK also supplies high resolution vacuum de-mountable x-ray sources for the following applications

XT H 225 X-ray and CT inspection system for industrial applications:

Full inner and outer inspection of industrial components Detailed measurement of internal component and assembly features is often vital for quality control, failure analysis and material research. XT H offers powerful X-ray sources, a large inspection volume, and high X-ray and CT imaging resolution.

XT H 450 micro-focus x-ray/CT system for inspection of blades and castings:

For more details, please check WEB Site:http://www.nikonmetrology.com/products/x-ray_and_ct_inspection/x-ray_electronics_inspection/

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    ZEVAC (Switzerland and USA)

BGA, uBGA, CSP, QFP, PLCC and all other SMT Components.

All models are  “Leadfree capable”

Standard machine with an outstanding price/performance  relation. Manual positioning and accurate placement.

DRS24  (Leadfree capable)

A special vision system (with motorized z-axis) for very accurate aligment of all SMD's and fine-pitch components. Ideal for BGAs, uBGAs, QFPs, PLCCs and all other ultrafine pitch QFPs.

ONYX 24      (Leadfree capable)

Semi-automatic process control for all kind of SMD rework applications. The bottom heater with a large surface of 300x300mm offers 3500 W heating power.  On all ONYX machines nitrogen input is standard. Automatic placement of components using Force Measuring System.  All existing SMD components like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings.  

ONYX 25      (Leadfree capable)

Semi-automated Selective Soldering and Desoldering System. All existing SMD components like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings, special and large SMT components upto 75mm. ONYX 25 is especially designed for extremely large boards-up to 520mm large and unlimited in the depth. Component height clearence is 30mm or 70mm high. Automatic placement of components using Force Measuring System.  REDDOT design award 2006

ONYX 29      (Leadfree capable)

Semi-automated selective Soldering and Desoldering System. All existing SMD components like 0201, CSP, BGA, uBGA, Flip Chip, LGA, connectors shieldings, special SMT components.

Automated Multifunctional Positioning and Soldering System. Hot Gas Soldering (Rework) System (Standard). Optional: Conductive Heat Soldering System, Flip Chip Bonder, Dispenser System.The entire ONYX32 is controlled and automated via the user-friendly software Visual Machines.

Through-Hole Multipin Connector or Leaded IC Solder Rework

SSM 4 and SSM4A (Leadfree capable)

Standard Model to solder and desolder leaded components, ICs, multi-pin connectors

SSM 9 (Leadfree capable)

Operator independent model to solder and desolder leaded components, ICs, multi-pin connectors

For more details, please check WEB Site:http://www.zevac.ch

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