PCB AND DIE ASSEMBLY

R&D Labs .... Equipment for Die Pick and Place, Die Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic, Microsystemtechnic, and many more...

Die Bonder & Component Placer with Wafer Table and Die Ejector .... Manual model, Semi Automatic model, Automatic model ...

Hybrid Rework System (die removal by shear) to remove all glued dies from substrate.

World Leader in Die Bonding and Flip Chip production technologies... Complete RFID production lines....

Flip Chip Bonder	8800 FC	Flip Chip Bonder with high volume and high accuracy
Flip Chip Bonder	8800 Chameo	Multi-Flip Chip Bonder for Stacked Packages and SIP
Die Bonder	2200 EVO	Twin-Head Multi-Chip Die Bonder with integrated dispenser and a die attach, flip chip applications (highest accuracy of 10µm @3s) --- Flexible and Versatile (Most popular model)
Die Sorter	DS9000	Cassette to Cassette Die Sorting System
Die Sorter	CS1250	High Speed Die Sorter for WLP and other Flipped Devices into Tape and Reel
Die Sorter	DS9-100	Wafer to wafer Die Sorting for class 100 clean rooms.
Die Sorter	DS11000	LED sorter with integrated vision inspection.
RFID Production Lines	8800 FC Smart Line	Dedicated equipment for RFID production. An assembly solution based on reel-to-reel production. Upon completion, the RFID is spooled, optionally tested and slitted, and provided with bad marks for the rejects.

53XX Series - Manual (budget) Wire Bonders (with programming assistance) : 5310, 5330, 53XX BDA

Plasma processes (such as Plasma Cleaning) for advanced semiconductor packaging and assembly (ASPA),

for purposes such as plasma cleaning of the surfaces before wire bonding, etc (AP-600 brochure)

Temperatures up to 1150°C, ±0.2°C, Fast ramping – Heats at 100°C/minute (max.), Fast cool down, Quartz process chamber, Up to 300mm diameter wafers or equivalent substrate size, Vacuum down to 5 x 10-6 mbar/Torr, Oxygen < 1 ppm, Multiple process gases.

Furnaces for laboratories, industrial furnaces, annealing chambers, climate ovens, incubators

Clean room ovens (from 250^oC to -80^oC), forced air-circulating, temperature profiling (ramp up speed adjustable)

Programmable temperature profiling with +/- 2^oC accuracy (or +/- 1^oC in limited ranges)

Semiconductor processing equipment from laboratory scale up to fully automated assembly units for processing wafers or substrates for the semiconductor industry, opto-electronics, MEMs, photovoltaics, display technology and sensor systems.

ATM Process equipment for processes before lithography (e.g. resist coating spinners with controlled dispensing, etc)

to processes after lithography -- wet processing such as developing, cleaning and baking.

Spinning, coating, developing cleaning and drying systems for semiconductor process

ATM Spin coating and Cleaning- OPTIspin ST22+

Stand - Alone Spinner System for Coating (e.g. resist), Cleaning or Developing applications

with hotplate for wafer up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm)

Spin Coating- OPTIcoat ST23

Stand alone spinner for coating including process

The future technology in the semiconductor industry and production-
Stand-Alone Spin Coating System with "Covered Chuck", Hotplate and HMDS within process:

Stand - Alone Spin Coating System with "Covered Chuck" technology with Hotplate and HMDS Hotplate for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150mm), for traditional open bowl or covered chuck spinning

OPTIcoat ST23 System consists of:

Stand - Alone cabinet with all process modules integrated
Spinner system with "Covered Chuck" technology and automatic substrate pin lift
Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
Hotplate OPTIhot HB 20 with lifting pins for 2" up to 8"
Vapor prime HMDS (HexaMethylDiSilazan) Hotplate OPTIhot VB 20
Input display unit with touch for spin coater and HMDS hotplate
Temperature controller and timer for hotplate
USB 2.0 port for data exchange
Including software for PC / Notebook - For more comfortable
recipe writing and storage
Including an ENGLISH manual on standard paper and a CD-ROM
Price without installation and training
Requires at least one chuck (Not included !)

Spin Coating- OPTIcoat SB20

Bench Mounted Spin Coating System with "Covered Chuck" technology

for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm),

for traditional open bowl or covered chuck spinning

OPTIcoat SB20 System consists of:

Spinner system with "Covered Chuck" technology and automatic substrate pin lift
Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
19" Controller unit with USB 2.0 port
Input display unit with touch
Including software for PC / Notebook - For more comfortable recipe writing and storage
Including an ENGLISH manual on standard paper and a CD-ROM
Price without installation and training
Requires at least one chuck (Not included !)

ATM Spin Wet- OPTIwet ST 60

Stand alone spinner for wet process

Stand - Alone Spin Wet Process System for wafer up to Ø 22” (Ø 560 mm) and substrates up to 16” x 16” (400 mm x 400 mm)

System consists of:

Stand - Alone cabinet with all process modules integrated
Process chamber made of polypropylene (PP) safety door
Including one programmable electronic media arm – Programmable in speed and position
Including Back Side Rinse nozzle for DI-Water
Emergency Stop Button
Input display unit with touch
USB 2.0 port for data exchange
Including software for PC / Notebook – For more comfortable recipe writing and storage
Including an ENGLISH manual on standard paper and a CD-ROM
Price without installation and training
Requires at least one chuck

Automatic Spin Coating- Maximus 806

The future technology in the semiconductor industry and production-
fully automatic and programmable cassette-to-cassette micro-cluster system:

Automatic Spin Coating and Developing System, with hotplates
for wafers sizes between Ø 4" up to Ø 8" (Ø 200mm) or
substrates up to 6" x 6" (150mm x 150mm)

Automatic Spin Coating- Maximus 806 System consists of:

1 Cabinet MAXIMUS 806
1 5-axis main robot
- wafer transport between loading unit, spinner and hot /cool plate stack
1 Loading Unit:
- 4 cassette loading stations
- 3-axis robot, carrying wafer from cassette to main robot
- self centering end effector
2 End effector vacuum standard for Ø 125mm and Ø 150mm wafer
1 Flat touch screen monitor
1 Computer as controller and user interface
1 Light beacon (red , yellow , green )
1 Remote control, for quick log file checking for service and maintenance purposes via modem or ISDN interface
1 Software for easy programming of station recipe and flow recipe at the system or on a connected PC
1 CE marked system
1 ENGLISH manual on standard paper and a CD-ROM

For other ATM process equipment, please check the company website. ATM Group Products

World Leader in Non-Destructive internal inspection using Scanning Acoustic Microscopes (S.A.M.)

Inspection Microscopes (Digital Camera Videoscopes) with X, Y,Z arms; Flexible endoscopes to inspect the solder balls under BGAs....

Xenon Cold Light Lamps, Thermo Inspection with Autofocus Infrared Camera, Image Processing and Archiving Software...

For more details, please check TechnoLab WEB Site:http://www.technolab.de/_en/products/index.php

Spin Coaters (with controlled and repeatable resist dispensing)

Wet Processing equipment to develop, clean and bake

BGA components

Electronic assemblies

PCB assembly

BGA solder joint inspection

IC Package Inspection

Automotive assemblies

Aerospace

Pharmaceutical Devices

NDT

Scientific and Research

Medical Research

Ordnance

XT V 130 -- New X-ray inspection system for electronics quality assurance.

30-130kV open micro-focus X-ray source, a 4-axis... Affordable but powerful.

Designed for 100% BGA and μBGA inspection, multi-layer board inspection and PCB solder joint inspection

In-house micro-focus source with 3-micron focal spot size

Change position, angle and zoom as desired

4-inch image intensifier, optically coupled to a high-resolution digital CCD camera

Large set of 16-bit image processing tools

True 60° tilting angle for easy inspection of internal features